mt46h32m16lf Micron Semiconductor Products, mt46h32m16lf Datasheet - Page 12

• Manufacturer Part Number: mt46h32m16lf
• Description: 512mb X16, X32 Mobile Ddr Sdram
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 6:
PDF: 09005aef82d5d305/Source: 09005aef82d5d2e7
512mb_ddr_mobile_sdram_t47m_density__2.fm - Rev. D 05/08 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls are
Ø0.42 on Ø0.4 SMD
ball pads.
Seating
plane
60x Ø0.45
0.1 A
7.2
0.8 TYP
60-Ball VFBGA Package
0.8 TYP
3.6
Notes:
A
9
1. All dimensions are in millimeters.
8
7
8 ±0.1
6.4
3.2
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
4.5 ±0.05
0.65 ±0.05
12
Ball A1 ID
0.3 ±0.025
9 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb: x16, x32 Mobile DDR SDRAM
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved
Micron logo
to be lased
ball A1 ID