LFEC10E-3F256C Lattice Semiconductor Corp., LFEC10E-3F256C Datasheet - Page 38

• Manufacturer Part Number: LFEC10E-3F256C
• Description: Latticeecp/ec Family of Fpga Devices Has Been Optimized to Deliver Mainstream Fpga Features at Low Cost.for Maximum Performance And Value, The Latticeecp (EConomy Plus) Fpga Concept Combines an Efficient Fpgafabric With High-speed Dedicated Functions
• Manufacturer: Lattice Semiconductor Corp.

Lattice Semiconductor
LatticeECP/EC devices contain two types of sysIO buffer pairs.
1. Top and Bottom sysIO Buffer Pair (Single-Ended Outputs Only)
2. Left and Right sysIO Buffer Pair (Differential and Single-Ended Outputs)
Supported Standards
The LatticeECP/EC sysIO buffer supports both single-ended and differential standards. Single-ended standards
can be further subdivided into LVCMOS, LVTTL and other standards. The buffers support the LVTTL, LVCMOS 1.2,
1.5, 1.8, 2.5 and 3.3V standards. In the LVCMOS and LVTTL modes, the buffer has individually configurable
options for drive strength, bus maintenance (weak pull-up, weak pull-down, or a bus-keeper latch) and open drain.
Other single-ended standards supported include SSTL and HSTL. Differential standards supported include LVDS,
BLVDS, LVPECL, differential SSTL and differential HSTL. Tables 2-13 and 2-14 show the I/O standards (together
with their supply and reference voltages) supported by the LatticeECP/EC devices. For further information on utiliz-
ing the sysIO buffer to support a variety of standards please see the details of additional technical information at
the end of this data sheet.
The sysIO buffer pairs in the top and bottom banks of the device consist of two single-ended output drivers and
two sets of single-ended input buffers (both ratioed and referenced). The referenced input buffer can also be
configured as a differential input.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
Only the I/Os on the top and bottom banks have PCI clamp.
The sysIO buffer pairs in the left and right banks of the device consist of two single-ended output drivers, two
sets of single-ended input buffers (both ratioed and referenced) and one differential output driver. The refer-
enced input buffer can also be configured as a differential input. In these banks the two pads in the pair are
described as “true” and “comp”, where the true pad is associated with the positive side of the differential I/O,
and the comp (complementary) pad is associated with the negative side of the differential I/O.
Only the left and right banks have LVDS differential output drivers.
2-28
LatticeECP/EC Family Data Sheet
Architecture