PCI9030-AA60BI PLX Technology, PCI9030-AA60BI Datasheet - Page 181
PCI9030-AA60BI
Manufacturer Part Number
PCI9030-AA60BI
Description
Peripheral Drivers & Components (PCIs) 32-bit 33MHz PCI v.2.2-compliant
Manufacturer
PLX Technology
Specifications of PCI9030-AA60BI
Package / Case
FPBGA-180
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Operating Supply Voltage
3.3 V
Lead Free Status / Rohs Status
No RoHS Version Available
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCI9030-AA60BI
Manufacturer:
PLX
Quantity:
250
Company:
Part Number:
PCI9030-AA60BI F
Manufacturer:
FUJI
Quantity:
4 300
Company:
Part Number:
PCI9030-AA60BIF
Manufacturer:
PLX
Quantity:
1 400
Company:
Part Number:
PCI9030-AA60BIF
Manufacturer:
PLX
Quantity:
246
Part Number:
PCI9030-AA60BIF
Manufacturer:
PLX
Quantity:
20 000
180-Pin µBGA
Table 13-4. Symbol Definitions—µBGA Package
PCI 9030 Data Book Version 1.4
© 2002 PLX Technology, Inc. All rights reserved.
Symbol
D
E
A
Package width
Package length
Height
Term
Figure 13-5. 180-Pin µBGA PCB Layout Suggested Land Pattern
Creating a solder mask
clearance using the Via pad
is not recommended.
Detail of
Each Pad
and Breakout
Via Pad Diameter
13 mm
0.508 mm
Width of package
Length of package
Height from the ground plane
to the top of the package
Definition
0.8 mm
Pin A1 Designator
(Silkscreen)
Copper Crop Lines (Allows for
visual inspection of whether the
µBGA is centered on the pads)
0.15 mm FHS
Topside View
Pin A1
Symbol
13 mm
A
e
b
1
Solder Mask Keepout
0.05–0.07 mm
Ball height
Ball pitch
Ball width
Solder Mask
0.35 mm
Diameter Land
Term
0.25 mm
1.27 mm
Height from the ground plane
to the bottom edge of the
package (PGA)
Theoretical lead pitch
Ball width or diameter
(excluding surface plating)
Physical Specifications
Definition
Section 13
13-5