EP2AGX65DF29C6N Altera, EP2AGX65DF29C6N Datasheet - Page 155

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EP2AGX65DF29C6N

Manufacturer Part Number
EP2AGX65DF29C6N
Description
IC ARRIA II GX FPGA 65K 780FBGA
Manufacturer
Altera
Series
Arria II GXr

Specifications of EP2AGX65DF29C6N

Number Of Logic Elements/cells
60214
Number Of Labs/clbs
2530
Total Ram Bits
5246
Number Of I /o
364
Voltage - Supply
0.87 V ~ 0.93 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Family Name
Arria® II GX
Number Of Logic Blocks/elements
63250
# I/os (max)
364
Frequency (max)
400MHz
Operating Supply Voltage (typ)
900mV
Logic Cells
63250
Ram Bits
5557452.8
Operating Supply Voltage (min)
0.87V
Operating Supply Voltage (max)
0.93V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
780
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

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Chapter 6: I/O Features in Arria II GX Devices
Arria II GX Design Considerations
Arria II GX Design Considerations
I/O Termination
© July 2010 Altera Corporation
f
1
A resistor network is required to attenuate the LVDS output voltage swing to meet
mini-LVDS specifications. You can modify the three-resistor network values to reduce
power or improve the noise margin. The resistor values chosen should satisfy the
equation shown in
Equation 6–2.
To validate that custom resistor values meet the RSDS requirements, Altera
recommends performing additional simulations with IBIS models.
For more information about the mini-LVDS I/O standard, see the mini-LVDS
Specification from the Texas Instruments website at www.ti.com.
While Arria II GX devices feature various I/O capabilities for high-performance and
high-speed system designs, the following items require attention to ensure the success
of these designs:
This section describes I/O termination requirements for single-ended and differential
I/O standards.
Single-Ended I/O Standards
Although single-ended, non-voltage-referenced I/O standards do not require
termination, impedance matching is necessary to reduce reflections and improve
signal integrity.
Voltage-referenced I/O standards require both an input reference voltage (V
termination voltage (V
termination voltage of the transmitting device. Each voltage-referenced I/O standard
requires a specific termination setup. For example, a proper resistive signal
termination scheme is critical in SSTL2 standards to produce a reliable DDR memory
system with a superior noise margin.
“I/O Termination” on page 6–21
“I/O Bank Restrictions” on page 6–22
“I/O Placement Guidelines” on page 6–23
Equation
TT
). The reference voltage of the receiving device tracks the
6–2.
R
R
S x
S +
R
2
R
P
2
P
= 50 Ω
Arria II GX Device Handbook, Volume 1
REF
) and a
6–21

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