WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 8

• Manufacturer Part Number: WG82574L S LBA9
• Description: CONTROLLER, ENET, INTEL 82574L, 64PQFN
• Manufacturer: Intel

Specifications of WG82574L S LBA9

• Ethernet Type: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: 0°C To +85°C
• Digital Ic Case Style: QFN
• No. Of Pins: 64
• Package / Case: QFN
• Interface Type: I2C, JTAG, PCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

14.0 Thermal Design Considerations.............................................................................. 470
15.0 Board Layout and Schematic Checklists ................................................................. 478
16.0 Models ................................................................................................................... 488
17.0 Reference Schematics ............................................................................................ 490
8
13.6
13.7
13.8
13.9
13.10 Assembly Process Flow ..................................................................................... 465
13.11 Reflow Guidelines ............................................................................................ 465
13.12 XOR Testing .................................................................................................... 467
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9
14.10 Reliability ....................................................................................................... 474
14.11 Measurements for Thermal Specifications............................................................ 475
14.12 Case Temperature Measurements ...................................................................... 475
14.13 Conclusion ...................................................................................................... 476
14.14 PCB Guidelines ................................................................................................ 477
13.5.3 Third-Party Magnetics Manufacturers ....................................................... 444
13.5.4 Designing the 82574 as a 10/100 Mb/s Only Device .................................. 445
13.5.5 Layout Considerations for the Ethernet Interface....................................... 446
13.5.6 Physical Layer Conformance Testing ........................................................ 452
13.5.7 Troubleshooting Common Physical Layout Issues ...................................... 452
SMBus and NC-SI ............................................................................................ 453
13.6.1 NC-SI Electrical Interface Requirements................................................... 454
82574 Power Supplies ...................................................................................... 458
13.7.1 82574 GbE Controller Power Sequencing.................................................. 458
13.7.2 Power and Ground Planes ...................................................................... 460
Device Disable................................................................................................. 460
13.8.1 BIOS Handling of Device Disable ............................................................. 461
82574 Exposed Pad* ........................................................................................ 461
13.9.1 Introduction ......................................................................................... 461
13.9.2 Component Pad, Solder Mask and Solder Paste ......................................... 462
13.9.3 Landing Pattern A (No Via In Pad) ........................................................... 463
13.9.4 Landing Pattern B (Thermal Relief; No Via In Pad)..................................... 464
Introduction .................................................................................................... 470
Intended Audience ........................................................................................... 470
Measuring the Thermal Conditions ..................................................................... 470
Thermal Considerations .................................................................................... 470
Packaging Terminology ..................................................................................... 471
Product Package Thermal Specification ............................................................... 471
Thermal Specifications...................................................................................... 472
14.7.1 Case Temperature ................................................................................ 472
14.7.2 Designing for Thermal Performance......................................................... 472
Thermal Attributes ........................................................................................... 472
14.8.1 Typical System Definitions ..................................................................... 472
82574 Package Thermal Characteristics .............................................................. 474
14.12.1Attaching the Thermocouple................................................................... 476
82574 GbE Controller—Datasheet