WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 465

• Manufacturer Part Number: WG82574L S LBA9
• Description: CONTROLLER, ENET, INTEL 82574L, 64PQFN
• Manufacturer: Intel

Specifications of WG82574L S LBA9

• Ethernet Type: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: 0°C To +85°C
• Digital Ic Case Style: QFN
• No. Of Pins: 64
• Package / Case: QFN
• Interface Type: I2C, JTAG, PCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Design Considerations—82574 GbE Controller
13.10
Figure 89.
13.11
Assembly Process Flow
Figure 89
Assembly Flow
Reflow Guidelines
The typical reflow profile consists of four sections. In the preheat section, the PCB
assembly should be preheated at the rate of 1 to 2 °C/sec to start the solvent
evaporation and to avoid thermal shock. The assembly should then be thermally
soaked for 60 to 120 seconds to remove solder paste volatiles and for activation of flux.
The reflow section of the profile, the time above liquidus should be between 45 to 60
seconds with a peak temperature in the range of 245 to 250 °C, and the duration at the
peak should not exceed 30 seconds. Finally, the assembly should undergo cool down in
the fourth section of the profile. A typical profile band is provided in
220 °C is referred to as an approximation of the liquidus point. The actual profile
parameters depend upon the solder paste used and specific recommendations from the
solder paste manufacturers should be followed.
shows the typical process flow for mounting packages to the PCB.
Figure
90, in which
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