WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 477

• Manufacturer Part Number: WG82574L S LBA9
• Description: CONTROLLER, ENET, INTEL 82574L, 64PQFN
• Manufacturer: Intel

Specifications of WG82574L S LBA9

• Ethernet Type: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: 0°C To +85°C
• Digital Ic Case Style: QFN
• No. Of Pins: 64
• Package / Case: QFN
• Interface Type: I2C, JTAG, PCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal Design Considerations—82574 GbE Controller
14.14
Note:
PCB Guidelines
The following general PCB design guidelines are recommended to maximize the thermal
performance of QFN packages:
The previously mentioned guidelines are not all inclusive and are defined to give
known, good design practices to maximize the thermal performance of the
components.
1. When connecting ground (thermal) vias-to the ground planes, do not use thermal-
2. Thermal-relief patterns are designed to limit heat transfer between the vias and the
3. As board temperature also has an effect on the thermal performance of the
4. If airflow exists, locate the components in the mainstream of the airflow path for
relief patterns.
copper planes, thus constricting the heat flow path from the component to the
ground planes in the PCB.
package, avoid placing 82574L adjacent to high power dissipation devices.
maximum thermal performance. Avoid placing the components downstream,
behind larger devices or devices with heat sinks that obstruct the air flow or supply
excessively heated air.
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