WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 463

• Manufacturer Part Number: WG82574L S LBA9
• Description: CONTROLLER, ENET, INTEL 82574L, 64PQFN
• Manufacturer: Intel

Specifications of WG82574L S LBA9

• Ethernet Type: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: 0°C To +85°C
• Digital Ic Case Style: QFN
• No. Of Pins: 64
• Package / Case: QFN
• Interface Type: I2C, JTAG, PCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Design Considerations—82574 GbE Controller
Figure 86.
13.9.3
Figure 87.
82574L Solder Paste
The stencil for the solder paste should be 5 mils thick. Also, use a solder paste alloy
consisting of 96.5Sn/3Ag/0.5Cu for a lead free process.
Landing Pattern A (No Via In Pad)
This landing pattern (vias outside Exposed Pad*) provides an extended ground
connection, adequate solder coverage and less solder voiding; however, it does not
provide thermal relief. This landing pattern also meets Intel’s recommendation for
coverage >= 80%.
82574L Landing Pattern A (Top View - Vias on the Outside of the Exposed
Pad*)
Use 12 vias distributed on four sides (three per side, as shown in
sides (four per side). Additional vias can be added to improve conductivity. If larger
vias can be used (14 to 20 mil finished hole size), then a minimum of 9 vias can be
evenly placed around the extended ground connection.
Metal Pattern
Extended Ground Connection
Without Thermal Relief
0.054 in. (1.38 mm) Square x 9
0.12 in.
0.30 mm
0.12 in.
0.30 mm
Solder Mask Opening
Figure
87) or three
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