WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 463
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WG82574L S LBA9
Manufacturer Part Number
WG82574L S LBA9
Description
CONTROLLER, ENET, INTEL 82574L, 64PQFN
Manufacturer
Intel
Datasheet
1.WG82574IT_S_LBAC.pdf
(490 pages)
Specifications of WG82574L S LBA9
Ethernet Type
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
0°C To +85°C
Digital Ic Case Style
QFN
No. Of Pins
64
Package / Case
QFN
Interface Type
I2C, JTAG, PCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Design Considerations—82574 GbE Controller
Figure 86.
13.9.3
Figure 87.
82574L Solder Paste
The stencil for the solder paste should be 5 mils thick. Also, use a solder paste alloy
consisting of 96.5Sn/3Ag/0.5Cu for a lead free process.
Landing Pattern A (No Via In Pad)
This landing pattern (vias outside Exposed Pad*) provides an extended ground
connection, adequate solder coverage and less solder voiding; however, it does not
provide thermal relief. This landing pattern also meets Intel’s recommendation for
coverage >= 80%.
82574L Landing Pattern A (Top View - Vias on the Outside of the Exposed
Pad*)
Use 12 vias distributed on four sides (three per side, as shown in
sides (four per side). Additional vias can be added to improve conductivity. If larger
vias can be used (14 to 20 mil finished hole size), then a minimum of 9 vias can be
evenly placed around the extended ground connection.
Metal Pattern
Extended Ground Connection
Without Thermal Relief
0.054 in. (1.38 mm) Square x 9
0.12 in.
0.30 mm
0.12 in.
0.30 mm
Solder Mask Opening
Figure
87) or three
463
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