WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 464

• Manufacturer Part Number: WG82574L S LBA9
• Description: CONTROLLER, ENET, INTEL 82574L, 64PQFN
• Manufacturer: Intel

Specifications of WG82574L S LBA9

• Ethernet Type: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: 0°C To +85°C
• Digital Ic Case Style: QFN
• No. Of Pins: 64
• Package / Case: QFN
• Interface Type: I2C, JTAG, PCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13.9.4
Figure 88.
464
Landing Pattern B (Thermal Relief; No Via In Pad)
This landing pattern (vias outside Exposed Pad*) provides thermal relief, adequate
solder coverage, and less solder voiding; however, it does not provide an extended
ground connection. This landing pattern also meets Intel’s recommendation for
coverage >= 80%.
82574L Landing Pattern B (Top View - Vias on the Outside of the Exposed
Pad*)
Intel recommends using 16 vias evenly placed (as shown in
extended ground connection. Additional vias can be added to improve conductivity. A
minimum of 12 larger vias (14 to 20 mil finished hole size) can also be used.
44 mil anti-pad
32 mil via pad
10 mil finished hole (small via)
14 to 20 mil finished hole (large thermal via)
82574 GbE Controller—Design Considerations
40 mil mimimum
8-spoke pattern
thermal relief
Figure
88) around the