WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 448

• Manufacturer Part Number: WG82574L S LBA9
• Description: CONTROLLER, ENET, INTEL 82574L, 64PQFN
• Manufacturer: Intel

Specifications of WG82574L S LBA9

• Ethernet Type: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: 0°C To +85°C
• Digital Ic Case Style: QFN
• No. Of Pins: 64
• Package / Case: QFN
• Interface Type: I2C, JTAG, PCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 75.
13.5.5.3
448
Layout for Discrete Magnetics
Board Stack-Up Recommendations
Printed circuit boards for these designs typically have four, six, eight, or more layers.
Although, the 82574 does not dictate the stack up, here is an example of a typical six-
layer board stack up:
This board stack up configuration can be adjusted to conform to specific OEM design
rules.
• Layer 1 is a signal layer. It can contain the differential analog pairs from the
• Layer 2 is a signal ground layer. Chassis ground may also be fabricated in Layer 2
• Layer 3 is used for power planes.
• Layer 4 is a signal layer.
• Layer 5 is an additional ground layer.
• Layer 6 is a signal layer. For 1000 BASE-T (copper) Gigabit designs, it is common to
Ethernet device to the magnetics module.
under the connector side of the magnetics module.
route two of the differential pairs (per port) on this layer.
RJ-45
Magnetics Module
82574 GbE Controller—Design Considerations
82574L