MCF5272CVF66 Freescale Semiconductor, MCF5272CVF66 Datasheet - Page 486

• Manufacturer Part Number: MCF5272CVF66
• Description: IC MPU 32BIT 66MHZ 196-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5272CVF66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• Ram Size: 1K x 32
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 196-MAPBGA
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Not Compliant

Electrical Characteristics
23.1.2
Table 23-2
1
23.1.3
Table 23-3
1
2
3
4
5
6
23-2
Maximum operating junction temperature
Maximum operating ambient temperature
Minimum operating ambient temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Use this maximum operating ambient temperature only as a system design guideline. All device operating parameters are
guaranteed only when the junction temperature lies within the specified range.
θ
recommends the use of θ
from exceeding the rated specification. System designers should be aware that device junction temperatures can be
significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature specification
can be verified by physical measurement in the customer’s system using the Ψ
the method described in EIA/JESD Standard 51-2.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
JA
and Ψ
jt
lists operating temperatures.
lists thermal resistance values.
parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection. Freescale
Operating Temperature
Resistance
Characteristic
MCF5272 ColdFire
JA
and power dissipation specifications in the system design to prevent device junction temperatures
Characteristic
Table 23-2. Operating Temperature
Table 23-3. Thermal Resistance
®
Integrated Microprocessor User’s Manual, Rev. 3
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Symbol
T
T
Amax
Amin
T
J
jt
parameter, the device power dissipation, and
Standard
Symbol
θ
θ
θ
100
70
θ
θ
θ
Ψ
JMA
JMA
JMA
0
JA
JB
JC
1
jt
Value
Extended
Freescale Semiconductor
Value
51
26
41
23
115
85
-40
2
15
10
1,6
1,2
1,3
1,3
1,3
1
4
5
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
°C