MT41J256M4HX-15E:D TR Micron Technology Inc, MT41J256M4HX-15E:D TR Datasheet - Page 6

• Manufacturer Part Number: MT41J256M4HX-15E:D TR
• Description: IC DDR3 SDRAM 1GBIT 78FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr

Specifications of MT41J256M4HX-15E:D TR

• Format - Memory: RAM
• Memory Type: DDR3 SDRAM
• Memory Size: 1G (256M x 4)
• Speed: 667MHz
• Interface: Parallel
• Voltage - Supply: 1.425 V ~ 1.575 V
• Operating Temperature: 0°C ~ 95°C
• Package / Case: 78-FBGA
• Organization: 256Mx4
• Density: 1Gb
• Address Bus: 17b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 220mA
• Pin Count: 78
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

List of Tables
Table 1: Key Timing Parameters ...................................................................................................................... 1
Table 2: Addressing ......................................................................................................................................... 2
Table 3: 78-Ball FBGA – x4, x8 Ball Descriptions .............................................................................................. 19
Table 4: 86-Ball FBGA – x4, x8 Ball Descriptions .............................................................................................. 21
Table 5: 96-Ball FBGA – x16 Ball Descriptions ................................................................................................. 23
Table 6: Absolute Maximum Ratings .............................................................................................................. 30
Table 7: Input/Output Capacitance ............................................................................................................... 31
Table 8: Thermal Characteristics .................................................................................................................... 32
Table 9: Timing Parameters Used for I
Table 10: I
Table 11: I
Table 12: I
Table 13: I
Table 14: I
Table 15: I
Table 16: I
Table 17: I
Table 18: I
Table 19: I
Table 20: I
Table 21: DC Electrical Characteristics and Operating Conditions ................................................................... 46
Table 22: DC Electrical Characteristics and Input Conditions .......................................................................... 46
Table 23: Input Switching Conditions ............................................................................................................ 47
Table 24: Control and Address Pins ................................................................................................................ 49
Table 25: Clock, Data, Strobe, and Mask Pins ................................................................................................. 49
Table 26: Differential Input Operating Conditions (CK, CK# and DQS, DQS#) .................................................. 50
Table 27: Allowed Time Before Ringback (
Table 28: Single-Ended Input Slew Rate Definition ......................................................................................... 52
Table 29: Differential Input Slew Rate Definition ............................................................................................ 54
Table 30: On-Die Termination DC Electrical Characteristics ........................................................................... 55
Table 31: R
Table 32: ODT Sensitivity Definition .............................................................................................................. 57
Table 33: ODT Temperature and Voltage Sensitivity ....................................................................................... 57
Table 34: ODT Timing Definitions ................................................................................................................. 58
Table 35: Reference Settings for ODT Timing Measurements .......................................................................... 58
Table 36: 34 Ohm Driver Impedance Characteristics ...................................................................................... 62
Table 37: 34 Ohm Driver Pull-Up and Pull-Down Impedance Calculations ...................................................... 63
Table 38: 34 Ohm Driver I
Table 39: 34 Ohm Driver I
Table 40: 34 Ohm Driver I
Table 41: 34 Ohm Output Driver Sensitivity Definition ................................................................................... 64
Table 42: 34 Ohm Output Driver Voltage and Temperature Sensitivity ............................................................ 64
Table 43: 40 Ohm Driver Impedance Characteristics ...................................................................................... 65
Table 44: 40 Ohm Output Driver Sensitivity Definition ................................................................................... 65
Table 45: 40 Ohm Output Driver Voltage and Temperature Sensitivity ............................................................ 66
Table 46: Single-Ended Output Driver Characteristics .................................................................................... 67
Table 47: Differential Output Driver Characteristics ....................................................................................... 68
Table 48: Single-Ended Output Slew Rate Definition ...................................................................................... 70
Table 49: Differential Output Slew Rate Definition ......................................................................................... 71
Table 50: DDR3-1066 Speed Bins ................................................................................................................... 72
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf – Rev. J 05/10 EN
DD0
DD1
DD
DD2N
DD2NT
DD4R
DD4W
DD5B
DD
DD7
DD
TT
Measurement Conditions for Power-Down Currents .................................................................. 36
Measurement Conditions for I
Maximum Limits ...................................................................................................................... 44
Effective Impedances ................................................................................................................ 56
Measurement Loop ................................................................................................................. 34
Measurement Loop ................................................................................................................. 35
Measurement Loop ................................................................................................................. 42
Measurement Loop ................................................................................................................ 38
Measurement Loop ................................................................................................................ 40
and I
Measurement Loop ............................................................................................................... 39
Measurement Loop .............................................................................................................. 37
DD3N
OH
OH
OH
Measurement Loop ................................................................................................ 37
/I
/I
/I
OL
OL
OL
Characteristics: V
Characteristics: V
Characteristics: V
DD
Measurements – Clock Units ........................................................... 33
t
DVAC) for CK - CK# and DQS - DQS# .............................................. 51
DD6
, I
DD6ET
DD
DD
DD
= V
= V
= V
, and I
6
DDQ
DDQ
DDQ
DD8
= 1.5V ................................................................ 63
= 1.575V ............................................................ 63
= 1.425V ............................................................ 64
Micron Technology, Inc. reserves the right to change products or specifications without notice.
.................................................................... 41
1Gb: x4, x8, x16 DDR3 SDRAM
© 2006 Micron Technology, Inc. All rights reserved.