HD6417760BP200QS Renesas Electronics America, HD6417760BP200QS Datasheet - Page 1336

IC SUPERH MCU ROMLESS 256BGA

HD6417760BP200QS

Manufacturer Part Number
HD6417760BP200QS
Description
IC SUPERH MCU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417760BP200QS

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Rev. 2.00 Feb. 12, 2010 Page 1252 of 1330
REJ09B0554-0200
(read)
D31-D0
DACKn
(SA: IO
CKIO
Bank
Precharge-sel
Address
CSn
RD/WR
RAS
CASS
DQMn
BS
CKE
NOTES:
IO
SA
DA
DACK set to active-high
Figure 33.29 Synchronous DRAM Normal Read Bus Cycle: READ Command,
memory)
: Dack device
: Single address DMA transfer
: Dual address DMA transfer
t
t
t
t
t
t
Tc1
CSD
RWD
RASD
AD
CASD2
DQMD
H/L
c1
t
Tc2
CASD2
Tc3
Tc4/Td1
t
Burst (CAS Latency = 3)
RDS
t
t
BSD
DACD
c1
t
t
Td2
AD
BSD
H/L
t
c5
RDH
c2
Td3
c3
Td4
c4
Td5
c5
Td6
c6
Td7
t
DQMD
c7
Td8
c8
t
t
t
t
t
AD
CSD
RWD
RASD
DACD

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