HD64F7047F50 Renesas Electronics America, HD64F7047F50 Datasheet - Page 97

IC SUPERH MCU FLASH 256K 100QFP

HD64F7047F50

Manufacturer Part Number
HD64F7047F50
Description
IC SUPERH MCU FLASH 256K 100QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7047r
Datasheet

Specifications of HD64F7047F50

Core Processor
SH-2
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
53
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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4.3
4.3.1
A sufficient evaluation at the user’s site is necessary to use the LSI, by referring the resonator
connection examples shown in this section, because various characteristics related to the crystal
resonator are closely linked to the user’s board design. As the resonator circuit constants will
depend on the resonator and the floating capacitance of the mounting circuit, the component value
should be determined in consultation with the resonator manufacturer. Ensure that a voltage
exceeding the maximum rating is not applied to the oscillator pin.
4.3.2
When using a crystal oscillator, place the crystal oscillator and its load capacitors as close as
possible to the XTAL and EXTAL pins. Do not route any signal lines near the oscillator circuitry
as shown in figure 4.5. Otherwise, correct oscillation can be interfered by induction.
Measures against radiation noise are taken in this LSI. If radiation noise needs to be further
reduced, usage of a multi-layer printed circuit board with ground planes is recommended.
Usage Notes
Note on Crystal Resonator
Notes on Board Design
Figure 4.5 Cautions for Oscillator Circuit System Board Design
Avoid
C
C
L2
L1
Signal A Signal B
XTAL
EXTAL
This LSI
Rev. 2.00, 09/04, page 55 of 720

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