DF2505FC26V Renesas Electronics America, DF2505FC26V Datasheet - Page 835

IC H8S/2505 MCU FLASH 144QFP

DF2505FC26V

Manufacturer Part Number
DF2505FC26V
Description
IC H8S/2505 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2505FC26V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
21.7.2
If no subclock is required, connect the OSC1 pin to Vss and leave the OSC2 pin open, as shown in
figure 21.10. The SUBSTP bit in LPWRCR must be set to 1.
If the SUBSTP bit is not set to 1, transitions to the power-down mode may not complete normally.
21.8
To eliminate noise from the subclock input from the OSC1 pin, the subclock is sampled using the
dividing clock φ. The sampling frequency is set using the NESEL bit in LPWRCR. For details, see
section 21.1.2, Low-Power Control Register (LPWRCR).
No sampling is performed in watch mode.
Handling Pins when Subclock Is Not Used
Subclock Waveform Generation Circuit
Figure 21.10 Pin Handling when Subclock Is Not Used
OSC2
OSC1
Rev. 6.00 Sep. 24, 2009 Page 787 of 928
Open
Section 21 Clock Pulse Generator
REJ09B0099-0600

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