DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 870

IC H8S/2214 MCU FLASH 112-TFBGA

DF2214BQ16V

Manufacturer Part Number
DF2214BQ16V
Description
IC H8S/2214 MCU FLASH 112-TFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of DF2214BQ16V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-TFBGA
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2214BQ16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendix B Internal I/O Register
RDR0—Receive Data Register 0
SCMR0—Smart Card Mode Register 0
Bit
Initial value
R/W
Rev.4.00 Sep. 18, 2008 Page 808 of 872
REJ09B0189-0400
Bit
Initial value
R/W
:
:
:
:
:
:
7
1
R
7
0
6
1
R
6
0
5
1
R
5
0
Smart Card Data Transfer Direction
Stores received serial data
0
1
TDR contents are transmitted LSB-first
Receive data is stored in RDR LSB-first
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
4
1
Smart Card Data Invert
0
1
R
4
0
TDR contents are transmitted as they are
Receive data is stored as it is in RDR
TDR contents are inverted before being transmitted
Receive data is stored in inverted form in RDR
Reserved
Only 0 should be written to this bit.
SDIR
R/W
3
0
H'FF7D
H'FF7E
R
3
0
SINV
R/W
2
0
R
2
0
1
1
R
1
0
SMIF
R/W
0
0
R
0
0
SCI0
SCI0

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