DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 6
DF2214BQ16V
Manufacturer Part Number
DF2214BQ16V
Description
IC H8S/2214 MCU FLASH 112-TFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets
1.HS2214ECB62H.pdf
(938 pages)
2.HEWH8E10A.pdf
(19 pages)
3.D12312SVTE25V.pdf
(341 pages)
Specifications of DF2214BQ16V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-TFBGA
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2214BQ16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 6 of 938
- Download datasheet (6Mb)
This manual comprises the following items:
1. General Precautions in the Handling of MPU/MCU Products
2. Configuration of this Manual
3. Overview
4. Table of Contents
5. Summary
6. Description of Functional Modules
When designing an application system that includes this LSI, take the points for caution into
account. Each section includes points for caution in relation to the descriptions given, and points
for caution in usage are given, as required, as the final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
The history of revisions is a summary of sections that have been revised and sections that have
been added to earlier versions. This does not include all of the revised contents. For details,
confirm by referring to the main description of this manual.
10. Appendix/Appendices
Rev.4.00 Sep. 18, 2008 Page iv of lx
REJ09B0189-0400
•
•
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Features
ii) I/O pins
iii) Description of Registers
iv) Description of Operation
v) Usage: Points for Caution
•
•
CPU and System-Control Modules
On-chip Peripheral Modules
Product-type codes and external dimensions
Main Revisions for this edition
Configuration of this Manual
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