DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 605

• Manufacturer Part Number: DF2214BQ16V
• Description: IC H8S/2214 MCU FLASH 112-TFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2214BQ16V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-TFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

15.1
The H8S/2214 Group has 128 kbytes of on-chip ROM (flash memory or masked ROM). The
ROM is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word
data in one state, making possible rapid instruction fetches and high-speed processing.
The on-chip ROM is enabled or disabled by setting the mode pins (MD2, MD1, and MD0).
The flash memory versions can be erased and programmed on-board as well as with a PROM
programmer.
15.1.1
Figure 15.1 shows a block diagram of the on-chip ROM.
Overview
Block Diagram
Figure 15.1 Block Diagram of ROM
H'01FFFE
H'000000
H'000002
Section 15 ROM
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'01FFFF
H'000001
H'000003
Rev.4.00 Sep. 18, 2008 Page 543 of 872
REJ09B0189-0400
Section 15 ROM