DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 45

• Manufacturer Part Number: DF2214BQ16V
• Description: IC H8S/2214 MCU FLASH 112-TFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2214BQ16V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-TFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

17.6 Software Standby Mode..................................................................................................... 628
17.7 Hardware Standby Mode.................................................................................................... 632
17.8 φ Clock Output Disabling Function ................................................................................... 633
Section 18 Electrical Characteristics ................................................................ 635
18.1 Absolute Maximum Ratings .............................................................................................. 635
18.2 Power Supply Voltage and Operating Frequency Range ................................................... 636
18.3 DC Characteristics ............................................................................................................. 637
18.4 AC Characteristics ............................................................................................................. 642
18.5 D/A Convervion Characteristics ........................................................................................ 657
18.6 Flash Memory Characteristics............................................................................................ 658
18.7 Usage Note......................................................................................................................... 659
Appendix A Instruction Set .............................................................................. 661
A.1
A.2
A.3
A.4
A.5
A.6
Appendix B Internal I/O Register ..................................................................... 737
B.1
B.2
Appendix C I/O Port Block Diagrams .............................................................. 827
C.1
17.5.1 Module Stop Mode ............................................................................................... 626
17.5.2 Usage Notes .......................................................................................................... 628
17.6.1 Software Standby Mode........................................................................................ 628
17.6.2 Clearing Software Standby Mode ......................................................................... 629
17.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode.... 629
17.6.4 Software Standby Mode Application Example..................................................... 630
17.6.5 Usage Notes .......................................................................................................... 631
17.7.1 Hardware Standby Mode ...................................................................................... 632
17.7.2 Hardware Standby Mode Timing.......................................................................... 632
18.4.1 Clock Timing ........................................................................................................ 642
18.4.2 Control Signal Timing .......................................................................................... 644
18.4.3 Bus Timing ........................................................................................................... 646
18.4.4 Timing of On-Chip Supporting Modules.............................................................. 653
18.4.5 DMAC Timing...................................................................................................... 656
Instruction List ................................................................................................................... 661
Instruction Codes ............................................................................................................... 685
Operation Code Map.......................................................................................................... 699
Number of States Required for Instruction Execution ....................................................... 703
Bus States during Instruction Execution ............................................................................ 717
Condition Code Modification ............................................................................................ 731
Addresses ........................................................................................................................... 737
Functions............................................................................................................................ 744
Port 1 Block Diagrams....................................................................................................... 827
Rev.4.00 Sep. 18, 2008 Page xliii of lx
REJ09B0189-0400