DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 34

• Manufacturer Part Number: DF2214BQ16V
• Description: IC H8S/2214 MCU FLASH 112-TFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2214BQ16V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-TFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

2.9
2.10 Usage Notes ......................................................................................................................... 65
Section 3 MCU Operating Modes .......................................................................71
3.1
3.2
3.3
3.4
3.5
Section 4 Exception Handling .............................................................................79
4.1
4.2
4.3
Rev.4.00 Sep. 18, 2008 Page xxxii of lx
REJ09B0189-0400
2.8.4
2.8.5
2.8.6
Basic Timing........................................................................................................................ 62
2.9.1
2.9.2
2.9.3
2.9.4
2.10.1 TAS Instruction....................................................................................................... 65
2.10.2 STM/LDM Instruction Usage ................................................................................. 66
2.10.3 Bit Manipulation Instructions ................................................................................. 66
2.10.4 Access Methods for Registers with Write-Only Bits .............................................. 68
Overview.............................................................................................................................. 71
3.1.1
3.1.2
Register Descriptions ........................................................................................................... 72
3.2.1
3.2.2
Operating Mode Descriptions .............................................................................................. 75
3.3.1
3.3.2
3.3.3
3.3.4
Pin Functions in Each Operating Mode ............................................................................... 77
Memory Map in Each Operating Mode ............................................................................... 77
Overview.............................................................................................................................. 79
4.1.1
4.1.2
4.1.3
Reset
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
Traces ................................................................................................................................ 86
Program Execution State......................................................................................... 61
Bus-Released State ................................................................................................. 61
Power-Down State .................................................................................................. 61
Overview................................................................................................................. 62
On-Chip Memory (ROM, RAM) ............................................................................ 62
On-Chip Supporting Module Access Timing ......................................................... 64
External Address Space Access Timing ................................................................. 65
Operating Mode Selection ...................................................................................... 71
Register Configuration............................................................................................ 72
Mode Control Register (MDCR) ............................................................................ 72
System Control Register (SYSCR) ......................................................................... 73
Mode 4 .................................................................................................................... 75
Mode 5 .................................................................................................................... 75
Mode 6 .................................................................................................................... 76
Mode 7 .................................................................................................................... 76
Exception Handling Types and Priority.................................................................. 79
Exception Handling Operation................................................................................ 80
Exception Sources and Vector Table ...................................................................... 80
Overview................................................................................................................. 82
Reset Types............................................................................................................. 82
Reset Sequence ....................................................................................................... 83
Interrupts after Reset............................................................................................... 85
State of On-Chip Supporting Modules after Reset Release .................................... 85
................................................................................................................................ 82