DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 62

• Manufacturer Part Number: DF2214BQ16V
• Description: IC H8S/2214 MCU FLASH 112-TFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2214BQ16V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-TFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 18.10 DMAC Timing ........................................................................................................ 656
Table 18.11 D/A Conversion Characteristics .............................................................................. 657
Table 18.12 Flash Memory Characteristics................................................................................. 658
Appendix A Instruction Set
Table A.1
Table A.2
Table A.3
Table A.4
Table A.5
Table A.6
Table A.7
Table A.8
Table A.9
Table A.10 Operation Code Map (1) ......................................................................................... 699
Table A.11 Operation Code Map (2) ......................................................................................... 700
Table A.12 Operation Code Map (3) ......................................................................................... 701
Table A.13 Operation Code Map (4) ......................................................................................... 702
Table A.14 Number of States per Cycle..................................................................................... 704
Table A.15 Number of Cycles in Instruction Execution ............................................................ 705
Table A.16 Instruction Execution Cycles................................................................................... 719
Table A.17 Condition Code Modification.................................................................................. 732
Appendix D Pin States
Table D.1
Appendix F Product Code Lineup
Table F.1
Rev.4.00 Sep. 18, 2008 Page lx of lx
REJ09B0189-0400
Data Transfer Instructions ....................................................................................... 663
Arithmetic Instructions............................................................................................ 666
Logical Instructions................................................................................................. 670
Shift Instructions ..................................................................................................... 671
Bit-Manipulation Instructions ................................................................................. 674
Branch Instructions ................................................................................................. 679
System Control Instructions .................................................................................... 682
Block Transfer Instructions ..................................................................................... 684
Instruction Codes..................................................................................................... 685
I/O Port States in Each Processing State ................................................................. 861
H8S/2214 Product Code Lineup.............................................................................. 867