LPC1343FHN33,551 NXP Semiconductors, LPC1343FHN33,551 Datasheet - Page 245

• Manufacturer Part Number: LPC1343FHN33,551
• Description: IC MCU 32BIT 32KB FLASH 33HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1343FHN33,551

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 28
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC1343
• Development Tools By Supplier: OM11039, OM11040, OM11046, OM11048
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Package: 33HVQFN EP
• Device Core: ARM Cortex M3
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4944; 935289655551

NXP Semiconductors
UM10375
User manual
13.8.2.5 SPI format with CPOL = 1,CPHA = 1
13.8.3 Semiconductor Microwire frame format
The transfer signal sequence for SPI format with CPOL = 1, CPHA = 1 is shown in
Figure
In this configuration, during idle periods:
If the SSP is enabled and there is valid data within the transmit FIFO, the start of
transmission is signified by the SSEL master signal being driven LOW. Master’s MOSI is
enabled. After a further one half SCK period, both master and slave data are enabled onto
their respective transmission lines. At the same time, the SCK is enabled with a falling
edge transition. Data is then captured on the rising edges and propagated on the falling
edges of the SCK signal.
After all bits have been transferred, in the case of a single word transmission, the SSEL
line is returned to its idle HIGH state one SCK period after the last bit has been captured.
For continuous back-to-back transmissions, the SSEL pins remains in its active LOW
state, until the final bit of the last word has been captured, and then returns to its idle state
as described above. In general, for continuous back-to-back transfers the SSEL pin is
held LOW between successive data words and termination is the same as that of the
single word transfer.
Figure 42
format when back-to-back frames are transmitted.
Fig 41. SPI Frame Format with CPOL = 1 and CPHA = 1
•
•
•
The CLK signal is forced HIGH.
SSEL is forced HIGH.
The transmit MOSI/MISO pad is in high impedance.
41, which covers both single and continuous transfers.
shows the Microwire frame format for a single frame.
All information provided in this document is subject to legal disclaimers.
SSEL
MOSI
MISO
SCK
Rev. 2 — 7 July 2010
Q
MSB
MSB
4 to 16 bits
LSB
LSB
Chapter 13: LPC13xx SSP
Figure 43
Q
UM10375
© NXP B.V. 2010. All rights reserved.
shows the same
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