MPC8536-RDK Freescale Semiconductor, MPC8536-RDK Datasheet - Page 21

• Manufacturer Part Number: MPC8536-RDK
• Description: BOARD REF COMEXPRESS MPC8536
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC ™r
• Type: MPUr

Specifications of MPC8536-RDK

• Contents: CSB1880, CSB1801, Cables, Documentation, Enclosure, Power Supply with cord
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Paragraph
Number
13.3.1.8
13.3.1.9
13.3.1.10
13.3.1.11
13.3.1.12
13.3.1.13
13.3.1.14
13.3.1.15
13.3.1.16
13.3.1.17
13.3.1.18
13.3.1.19
13.3.1.20
13.3.1.21
13.3.1.22
13.3.1.23
13.4
13.4.1
13.4.1.1
13.4.1.2
13.4.1.3
13.4.1.4
13.4.1.5
13.4.1.6
13.4.1.7
13.4.1.8
13.4.2
13.4.2.1
13.4.2.2
13.4.2.3
13.4.2.3.1
13.4.2.3.2
13.4.2.3.3
13.4.2.3.4
13.4.2.3.5
13.4.2.4
13.4.2.5
13.4.3
13.4.3.1
13.4.3.1.1
13.4.3.1.2
Freescale Semiconductor
Functional Description................................................................................................. 13-42
Basic Architecture.................................................................................................... 13-43
General-Purpose Chip-Select Machine (GPCM)..................................................... 13-48
Flash Control Machine (FCM) ................................................................................ 13-59
MPC8536E PowerQUICC III Integrated Processor Reference Manual, Rev. 1
UPM Refresh Timer (LURT)............................................................................... 13-25
Transfer Error Status Register (LTESR) .............................................................. 13-26
Transfer Error Check Disable Register (LTEDR)................................................ 13-28
Transfer Error Interrupt Enable Register (LTEIR) .............................................. 13-29
Transfer Error Attributes Register (LTEATR) ..................................................... 13-30
Transfer Error Address Register (LTEAR).......................................................... 13-31
Transfer Error ECC Register (LTECCR)............................................................. 13-31
Local Bus Configuration Register (LBCR) ......................................................... 13-32
Clock Ratio Register (LCRR).............................................................................. 13-34
Flash Mode Register (FMR)................................................................................ 13-35
Flash Instruction Register (FIR) .......................................................................... 13-37
Flash Command Register (FCR) ......................................................................... 13-38
Flash Block Address Register (FBAR)................................................................ 13-39
Flash Page Address Register (FPAR) .................................................................. 13-39
Flash Byte Count Register (FBCR) ..................................................................... 13-41
Flash ECC Blockn Register (FECC0–FECC3) ................................................... 13-41
Address and Address Space Checking ................................................................ 13-43
External Address Latch Enable Signal (LALE) .................................................. 13-43
Data Transfer Acknowledge (TA) ....................................................................... 13-45
Data Buffer Control (LBCTL)............................................................................. 13-46
Atomic Operation ................................................................................................ 13-46
Parity Generation and Checking (LDP)............................................................... 13-47
Bus Monitor ......................................................................................................... 13-47
PLL Bypass Mode ............................................................................................... 13-47
GPCM Read Signal Timing ................................................................................. 13-49
GPCM Write Signal Timing ................................................................................ 13-51
Chip-Select Assertion Timing ............................................................................. 13-52
External Access Termination (LGTA) ................................................................. 13-57
GPCM Boot Chip-Select Operation .................................................................... 13-58
FCM Buffer RAM ............................................................................................... 13-61
Programmable Wait State Configuration......................................................... 13-53
Chip-Select and Write Enable Negation Timing ............................................. 13-53
Relaxed Timing ............................................................................................... 13-54
Output Enable (LOE) Timing .......................................................................... 13-56
Extended Hold Time on Read Accesses .......................................................... 13-56
Buffer Layout and Page Mapping for Small-Page NAND Flash Devices ...... 13-61
Buffer Layout and Page Mapping for Large-Page NAND Flash Devices ...... 13-62
Contents
Title
Number
Page
xxi