HD6417032F20V Renesas Electronics America, HD6417032F20V Datasheet - Page 535

SH1 ROMLESS LEAD FREE

HD6417032F20V

Manufacturer Part Number
HD6417032F20V
Description
SH1 ROMLESS LEAD FREE
Manufacturer
Renesas Electronics America
Series
SuperH® SH7030r
Datasheet

Specifications of HD6417032F20V

Core Processor
SH-1
Core Size
32-Bit
Speed
20MHz
Connectivity
EBI/EMI, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417032F20V
Manufacturer:
TI
Quantity:
201
Part Number:
HD6417032F20V
Manufacturer:
RENESAS
Quantity:
20
Notes: 1. For t
WRH, WRL,
WRH, WRL,
AD15–AD0
AD15–AD0
WR(Read)
WR(Write)
DPH, DPL
DPH, DPL
RD(Write)
RD(Read)
A21–A0
DACK0
DACK1
DACK0
DACK1
(Read)
(Read)
(Write)
(Write)
(Write)
RAS
CAS
2. For t
3. For t
4. t
CK
RDH
Figure 20.26 DRAM Bus Cycle: (Long-Pitch, Normal Mode)
CAC2
ACC2
RAC2
is measured from A21–A0, CAS, or RAS, whichever is negated first.
, use t
, use t
, use t
T
cyc
cyc
cyc
p
(n + 1) – 35 instead of t
(n + 2) – 44 instead of t
(n + 2.5) – 35 instead of t
t
t
RASD1
AD
T
r
Row
t
RAH
t
t
t
WPDD1
RDD
t
DACD1
t
t
AD
WDD1
WSD1
Tc
cyc
cyc
Rev. 7.00 Jan 31, 2006 page 507 of 658
1
t
t
CASD2
DACD3
cyc
t
t
ACC2
RAC2
Section 20 Electrical Characteristics
(n + 1) – t
(n + 2) – t
t
WCH
(n + 2.5) – t
Column
*2
*3
t
WSD2
t
DS
Tc
CASD2
AD
t
t
2
CAC2
DACD3
– t
RASD1
*1
RDS
– t
t
t
t
t
t
t
RASD2
RSD
DACD2
WDH
REJ09B0272-0700
RDS
WPDH
RDS
.
– t
.
RDS
t
RDH
t
CASD3
.
*4

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