DS3184DK Maxim Integrated Products, DS3184DK Datasheet - Page 381

• Manufacturer Part Number: DS3184DK
• Description: KIT DEMO FOR DS3184
• Manufacturer: Maxim Integrated Products

Specifications of DS3184DK

• Main Purpose: Telecom, ATM / Packet PHYs
• Utilized Ic / Part: DS3184
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Embedded: -
• Primary Attributes: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

16 PACKAGE THERMAL INFORMATION
The 36 thermal VSS balls in the center 6X6 matrix must be thermally and electrically connected to the
internal GND plane of the PC board to achieve these thermal characteristics.
Target Ambient Temperature Range
Die Junction Temperature Range
Theta-JA, Still Air
Note 1:
Theta-JA is based on the package mounted on a 4-layer JEDEC board
and measured in a JEDEC test chamber.
PARAMETER
-40°C to +85°C
-40 to +125°C
12.6 °C/W (Note 1)
VALUE
381