NNDK-MOD5272-KIT NetBurner Inc, NNDK-MOD5272-KIT Datasheet - Page 496

• Manufacturer Part Number: NNDK-MOD5272-KIT
• Description: KIT DEVELOP NETWORK FOR MOD5272
• Manufacturer: NetBurner Inc
• Series: ColdFire®r

Specifications of NNDK-MOD5272-KIT

• Main Purpose: *
• Embedded: *
• Utilized Ic / Part: MOD5272
• Primary Attributes: *
• Secondary Attributes: *
• Processor To Be Evaluated: MOD5272
• Interface Type: RS-232, RS-485, USB
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: 528-1001

Maximum Ratings
23.1.2 Operating Temperature
Table 23-2 lists operating temperatures.
23.1.3 Resistance
Table 23-3 lists thermal resistance values.
23-2
1
2
3
4
5
6
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
1
Maximum operating junction temperature
Maximum operating ambient temperature
Minimum operating ambient temperature
θ
Motorola recommends the use of θ
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the Ψ
EIA/JESD Standard 51-2.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JT.
JA
Use this maximum operating ambient temperature only as a system design guideline. All device operating
parameters are guaranteed only when the junction temperature lies within the specified range.
and Ψ
jt
parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection.
Characteristic
Characteristic
Table 23-2. Operating Temperature
jt
parameter, the device power dissipation, and the method described in
Table 23-3. Thermal Resistance
JA
and power dissipation specifications in the system design to prevent
MCF5272 User’s Manual
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Symbol
T
T
Amax
Amin
T
J
Standard
Symbol
100
70
θ
θ
θ
θ
0
θ
θ
Ψ
JMA
JMA
JMA
1
JA
JB
JC
jt
Value
Extended
115
85
-40
Value
51
26
41
23
2
15
10
1
1,6
1,2
1,3
1,3
1,3
4
5
MOTOROLA
Unit
°C
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit