PIC18C242 MICROCHIP [Microchip Technology], PIC18C242 Datasheet - Page 4

• Manufacturer Part Number: PIC18C242
• Description: High-Performance Microcontrollers with 10-Bit A/D
• Manufacturer: MICROCHIP [Microchip Technology]

PIC18CXX2
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer1 Module ........................................................................................................................................................................... 97
11.0 Timer2 Module ......................................................................................................................................................................... 102
12.0 Timer3 Module ......................................................................................................................................................................... 105
13.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 109
14.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 117
15.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART).............................................................. 151
16.0 10-bit Analog-to-Digital Converter (A/D) Module ...................................................................................................................... 167
17.0 Low Voltage Detect .................................................................................................................................................................. 175
18.0 Special Features of the CPU .................................................................................................................................................... 181
19.0 Instruction Set Summary .......................................................................................................................................................... 191
20.0 Development Support............................................................................................................................................................... 235
21.0 Electrical Characteristics .......................................................................................................................................................... 241
22.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 273
23.0 Packaging Information.............................................................................................................................................................. 275
Appendix A:
Appendix B:
Appendix C:
Appendix D:
Appendix E:
Appendix F:
On-Line Support................................................................................................................................................................................. 293
Reader Response .............................................................................................................................................................................. 294
PIC18CXX2 Product Identification System ........................................................................................................................................ 295
DS39026B-page 4
Index ................................................................................................................................................................................................. 287
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Device Overview .......................................................................................................................................................................... 5
Oscillator Configurations ............................................................................................................................................................ 15
Reset .......................................................................................................................................................................................... 23
Memory Organization ................................................................................................................................................................. 33
Table Reads/Table Writes .......................................................................................................................................................... 53
8 X 8 Hardware Multiplier ........................................................................................................................................................... 61
Interrupts .................................................................................................................................................................................... 65
I/O Ports ..................................................................................................................................................................................... 77
Timer0 Module ........................................................................................................................................................................... 93
http://www.microchip.com
Revision History ......................................................................................................................................................... 283
Device Differences..................................................................................................................................................... 283
Conversion Considerations........................................................................................................................................ 284
Migration from Baseline to Enhanced Devices .......................................................................................................... 284
Migration from Midrange to Enhanced Devices ......................................................................................................... 285
Migration from High-end to Enhanced Devices ......................................................................................................... 285
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Preliminary
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