tc59ym916bkg24a ETC-unknow, tc59ym916bkg24a Datasheet - Page 2

• Manufacturer Part Number: tc59ym916bkg24a
• Description: The Second Generation 512-megabit Xdrtm Dram
• Manufacturer: ETC-unknow

PIN ASSIGNMENT (TOP VIEW)
XDR DRAM CSP x16
Key Timing Parameters/Part Numbers
a. Bank × Row × Column × Width
b. Data rate measured in Mbit/s per DQ differential pair. See “Timing Conditions” on page 60 and “Timing Characteristics” on page
c. Read access time t
d. Timing parameter bin. See “Timing Parameters” on page 63. This is a measure of the number of interleaved read transactions
62. Note that t
needed for maximum efficiency (the value Ceiling (t
For bin A, t
8 × 4K × 1K × 16
8 × 4K × 1K × 16
8 × 4K × 1K × 16
8 × 4K × 1K × 16
8 × 4K × 1K × 16
8 × 4K × 1K × 16
Organization
RC−A
BIT
Note:
/ t
a
= t
RR−D
10
11
12
13
14
15
16
RAC
1
2
3
4
5
6
7
8
9
CYCLE
DQN7
DQ11
(=t
DQN3
DQN15
DQN11
DQ15
GND
GND
DQ3
V
V
DQ7
= 4, and for bin B, t
DD
DD
L
RCD−R
/ 8.
•
•
• RSRV: Reserved pin
• DQ8…DQ15, DQN8…DQN15 are RSRV’s for ×8
• DQ4…DQ15, DQN4…DQN15 are RSRV’s for ×4
Bandwidth (1/t
DQN9
VTERM
DQN5
GND
DQN13
DQN1
DQ1
DQ9
GND
DQ13
DQ5
V
K
DD
+ t
: Optional ball / Depopulated
: Depopulated
CAC
2400
3200
3200
3200
4000
4000
VTERM
VTERM
GND
V
GND
GND
CMD
SCK
GND
V
V
V
DD
DD
DD
J
DD
) measured in ns. See “Timing Parameters” on page 63.
BIT
RC−R
RQ10
GND
RQ11
GND
GND
RQ9
RQ8
V
)
H
DD
b
TC59YM916BKG24A,32A,32B,40B,32C,40C
/ t
RC-R
RR−D
GND
RQ6
CFM
CFMN
V
V
V
RQ7
DD
DD
G
DD
Latency (t
/t
RR-D
= 5
GND
GND
V
V
DD
F
36
27
35
35
28
28
DD
).
RAC
RSRV
RSRV
GND
GND
VREF
RQ5
GND
V
E
DD
)
c
RQ3
RQ4
RQ2
V
RQ1
V
V
V
D
DD
DD
DD
DD
Bin
VTERM
GND
VTERM
GND
GND
SDO
GND
RQ0
GND
RST
SDI
C
C
V
A
A
B
B
C
DD
d
DQN4
VTERM
GND
DQN12
DQ12
DQN0
DQN8
DQ4
DQ8
V
GND
DQ0
B
DD
DQN14
DQ14
DQN6
DQN2
GND
DQN10
GND
DQ6
DQ10
TC59YM916BKG24A
TC59YM916BKG32A
TC59YM916BKG32B
TC59YM916BKG32C
TC59YM916BKG40B
TC59YM916BKG40C
DQ2
V
V
A
DD
DD
2004-12-15 2/76
Part Number
Rev 0.1