UPD78F0838 Renesas Electronics Corporation., UPD78F0838 Datasheet - Page 884

• Manufacturer Part Number: UPD78F0838
• Description: 8-bit Single-chip Microcontrollers
• Manufacturer: Renesas Electronics Corporation.

<R>
sales representative.
Caution Do not use different soldering methods together (except for partial heating).
882
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
64-pin plastic LQFP (10
78F0844GBA-GAH-AX, 78F0844GBA2-GAH-AX, 78F0845GBA-GAH-AX, 78F0845GBA2-GAH-AX
80-pin plastic LQFP (12
78F0840GKA-GAK-AX, 78F0840GKA2-GAK-AX, 78F0841GKA-GAK-AX, 78F0841GKA2-GAK-AX,
78F0842GKA-GAK-AX, 78F0842GKA2-GAK-AX, 78F0843GKA-GAK-AX, 78F0843GKA2-GAK-AX,
78F0846GKA-GAK-AX, 78F0846GKA2-GAK-AX, 78F0847GKA-GAK-AX, 78F0847GKA2-GAK-AX,
78F0848GKA-GAK-AX, 78F0848GKA2-GAK-AX, 78F0849GKA-GAK-AX, 78F0849GKA2-GAK-AX
PD78F0836GBA-GAH-AX, 78F0836GBA2-GAH-AX, 78F0837GBA-GAH-AX, 78F0837GBA2-GAH-AX,
PD78F0838GKA-GAK-AX, 78F0838GKA2-GAK-AX, 78F0839GKA-GAK-AX, 78F0839GKA2-GAK-AX,
Infrared reflow
Partial heating
Soldering Method
CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS
Table 31-1. Surface Mounting Type Soldering Conditions
T. B. D.
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
10)
12)
Preliminary User’s Manual U19748EJ1V0UD
Soldering Conditions
T. B. D.
Condition Symbol
Recommended