HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 99

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

BSREQ
BSACK
Note: Power must be supplied to the on-chip PLL power supply pins (VDD-PLL1, VDD-PLL2, VSS-PLL1, VSS-PLL2,
RESET
BREQ/
BACK/
CS6
RDY
D38
D41
D39
D40
D15
D14
D13
D12
D10
RD2
CS0
CS1
CS5
D47
D32
D46
D33
D45
D34
D44
D35
D43
D36
D42
D0
D1
D2
D3
D4
D9
D5
VDD-CPG, VSS-CPG, VDD-RTC, and VSS-RTC) regardless of whether or not the PLL circuits, crystal oscillation
circuit, and RTC are used.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1
2
3
4
CS4
BS
D11
Figure 1.5 Pin Arrangement (292-Pin BGA)
5
D37
D7
WE4/CAS4/DQM4
6
7
8
9
(Top view)
BGA292
10
11
12
DQM2/ICIORD
13
WE2/CAS2/
Rev.7.00 Oct. 10, 2008 Page 13 of 1074
MD1/TXD2
14
CA
D26
D63
D53
15
16
17
18
Section 1 Overview
19
REJ09B0366-0700
VDDQ (IO)
VDD (internal)
VSS
20
WE7/CAS7/DQM7/
REG
XTAL2
VSS-RTC
NMI
IRL1
IRL2
MD2/RXD2
IRL0
RD/WR2
MD0/SCK
D62
D48
D61
D49
D60
D50
D59
D51
D58
D52
D57
D54
D56
D55
D31
D16
D30
D17
D29
D18
D28
D19
D27
D20
D21
D25
DREQ1