HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 113

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
Pin
No.
VSSQ
Pin Name
DRAK0
VDDQ
VSSQ
CS3
CS2
VDD
VSS
RAS
RD/CASS/
FRAME
RD/WR
WE2/CAS2/
DQM2/
ICIORD
WE3/CAS3/
DQM3/
ICIOWR
WE6/CAS6/
DQM6
VDDQ
WE7/CAS7/
DQM7/REG
D23
D24
D22
RXD
DREQ0
DREQ1
D25
D21
D26
D20
O
Power
Power
O
O
Power
Power
O
O
O
O
O
O
Power
Power
O
I/O
I/O
I/O
I
I
I
I/O
I/O
I/O
I/O
I/O
Function
DMAC0 request
acknowledge
IO VDD (3.3 V)
IO GND (0 V)
Chip select 3
Chip select 2
Internal VDD
Internal GND
(0 V)
RAS
Read/CAS/
FRAME
Read/write
D23–D16 select
signal
D31–D24 select
signal
D55–D48 select
signal
IO VDD (3.3 V)
IO GND (0 V)
D63–D56 select
signal
Data
Data
Data
SCI Data input
Request from
DMAC0
Request from
DMAC1
Data
Data
Data
Data
Reset
CS3
CS2
OE
RD/WR RD/WR RD/WR RD/WR
WE2
WE3
WE6
WE7
SRAM
Rev.7.00 Oct. 10, 2008 Page 27 of 1074
(CS3)
(CS2)
RAS
CAS2
CAS3
CAS6
CAS7
DRAM
Memory Interface
SDRAM PCMCIA MPX
CS3
CS2
RAS
CAS
DQM2
DQM3
DQM6
DQM7
Section 1 Overview
OE
ICIORD
ICIOWR
REG
REJ09B0366-0700
CS3
CS2
FRAME
RD/WR
A23
A24
A22
A25
A21
A20