DF2268FA13V Renesas Electronics America, DF2268FA13V Datasheet - Page 37

• Manufacturer Part Number: DF2268FA13V
• Description: IC H8S/2268 MCU FLASH 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2268FA13V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 23 Power Supply Circuit.......................................................................571
23.1 When Internal Power Step-Down Circuit Is Used ............................................................ 571
Section 24 List of Registers ...............................................................................573
24.1 Register Addresses (by Function Module, in Address Order) .......................................... 574
24.2 Register Bits...................................................................................................................... 582
24.3 Register States in Each Operating Mode........................................................................... 590
Section 25 Electrical Characteristics .................................................................597
25.1 Power Supply Voltage and Operating Frequency Range .................................................. 597
25.2 Electrical Characteristics of H8S/2268 Group .................................................................. 599
25.3 Electrical Characteristics of H8S/2264 Group .................................................................. 621
25.4 Operation Timing.............................................................................................................. 638
25.5 Usage Note........................................................................................................................ 641
Appendix A I/O Port States in Each Pin State...................................................643
A.1
A.2
Appendix B Product Codes................................................................................646
22.11.5 Writing to MSTPCR ............................................................................................ 570
22.11.6 Entering Subactive/Watch Mode and DTC Module Stop
25.2.1 Absolute Maximum Ratings ................................................................................ 599
25.2.2 DC Characteristics ............................................................................................... 600
25.2.3 AC Characteristics ............................................................................................... 610
25.2.4 A/D Conversion Characteristics........................................................................... 615
25.2.5 D/A Conversion Characteristics........................................................................... 616
25.2.6 LCD Characteristics............................................................................................. 617
25.2.7 DTMF Characteristics.......................................................................................... 618
25.2.8 Flash Memory Characteristics ............................................................................. 619
25.3.1 Absolute Maximum Ratings ................................................................................ 621
25.3.2 DC Characteristics ............................................................................................... 622
25.3.3 AC Characteristics ............................................................................................... 631
25.3.4 A/D Conversion Characteristics........................................................................... 636
25.3.5 LCD Characteristics............................................................................................. 637
25.4.1 Oscillator Settling Timing.................................................................................... 638
25.4.2 Control Signal Timings........................................................................................ 638
25.4.3 Timing of On-Chip Peripheral Modules .............................................................. 639
I/O Port State in Each Pin State of H8S/2268 Group........................................................ 643
I/O Port State in Each Pin State of H8S/2264 Group........................................................ 644
(Supported Only by H8S/2268 Group) ................................................................ 570
Rev. 5.00 Sep. 01, 2009 Page xxxv of l
REJ09B0071-0500