MSC8103M1100 Motorola / Freescale Semiconductor, MSC8103M1100 Datasheet - Page 53

• Manufacturer Part Number: MSC8103M1100
• Description: Network Processor, Networking Digital Signal Processor
• Manufacturer: Motorola / Freescale Semiconductor

2.4 Thermal Characteristics
2.5 DC Electrical Characteristics
Table 2-3 describes thermal characteristics of the MSC8101.
See Section 4.1, Thermal Design Considerations, on page 4-1 for details on these characteristics.
This section describes the DC electrical characteristics for the MSC8101. The measurements in Table 2-4
assume the following system conditions:
• T
•
•
•
Note:
Junction-to-ambient
Junction-to-board (bottom)
Junction-to-case (top)
Notes:
Input high voltage, all inputs except CLKIN
Input low voltage
CLKIN input high voltage
CLKIN input low voltage
Input leakage current, V
Tri-state (high impedance off state) leakage current,
V
Signal low input current, V
Signal high input current, V
Output high voltage, I
Output low voltage, I
Notes:
V
V
GND
IN
DD
DDH
J
= 0 – 100 °C
= V
= 1.6 V ± 5% V
= 0 V
DDH
= 3.3 V ± 5% V
The leakage current is measured for nominal
the same direction (for example, both
1.
2.
3.
4.
5.
1.
DC
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer (1s) board horizontal.
Thermal resistance between the die and the printed circuit board per JESD 51-8.
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for case
temperature.
Numbers based on simulations. Actual values TBD.
The optimum CLKIN duty cycle is obtained when: V
1, 2
4
OL
OH
Characteristic
Characteristic
= 3.2 mA
1
IN
DC
= –2 mA, except open drain pins
3
DC
IL
= V
IH
= 0.4 V
= 2.0 V
DDH
Table 2-4. DC Electrical Characteristics
Table 2-3. Thermal Characteristics
V
DDH
and
V
DDH
V
DD
Symbol
and
ILC
R
R
R
V
V
V
V
Symbol
vary by ± 5 percent).
V
I
V
I
OZ
I
IHC
I
ILC
IN
OH
OL
JC
H
JA
JB
IH
L
IL
= V
V
or
or
or
DD
DDH
JA
JB
JC
or both
– V
GND
GND
Min
IHC
2.0
2.5
2.4
—
—
—
—
—
.
Thermal Characteristics
V
17
DDH
FC-PBGA
Lidded
9.5
0.8
26
and
17mm
3.465
3.465
Max
–4.0
0.8
0.8
4.0
0.4
10
10
—
V
DD
must vary in
°C/W
°C/W
°C/W
Unit
Unit
mA
mA
µA
µA
V
V
V
V
V
V
2-3