HD6417750SBP200 Renesas Electronics America, HD6417750SBP200 Datasheet - Page 548

IC SUPERH MPU ROMLESS 256BGA

HD6417750SBP200

Manufacturer Part Number
HD6417750SBP200
Description
IC SUPERH MPU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SBP200

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 2.07 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750SBP200
Manufacturer:
HITACHI
0
Part Number:
HD6417750SBP200
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Section 13 Bus State Controller (BSC)
Rev.7.00 Oct. 10, 2008 Page 462 of 1074
REJ09B0366-0700
Figure 13.24 shows the timing of the CAS-before-RAS refresh cycle.
The number of RAS assert cycles in the refresh cycle is specified by bits TRAS2–TRAS0 in
MCR. The specification of the RAS precharge time in the refresh cycle is determined by the
setting of bits TRC2–TRC0 in MCR.
Figure 13.24 DRAM CAS-Before-RAS Refresh Cycle Timing (TRAS = 0, TRC = 1)
CKIO
A25–A0
CSn
RD/WR
RAS
CAS
D63–D0
BS
TRr1
TRr2
TRr3
TRr4
TRr5
Trc
Trc
Trc

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