HD6417750SBP200 Renesas Electronics America, HD6417750SBP200 Datasheet - Page 517

IC SUPERH MPU ROMLESS 256BGA

HD6417750SBP200

Manufacturer Part Number
HD6417750SBP200
Description
IC SUPERH MPU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SBP200

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 2.07 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750SBP200
Manufacturer:
HITACHI
0
Part Number:
HD6417750SBP200
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Table 13.13 16-Bit External Device/Little-Endian Access and Data Alignment
Access
Size
Byte
Word
Long-
word
Quad-
word
Operation
Address No. D31–D24 D23–D16 D15–D8 D7–D0
2n
2n + 1
2n
4n
4n + 2
8n
8n + 2
8n + 4
8n + 6
1
1
1
1
2
1
2
3
4
Data Bus
Data
7–0
Data
15–8
Data
15–8
Data
31–24
Data
15–8
Data
31–24
Data
47–40
Data
63–56
Data
7–0
Data
7–0
Data
7–0
Data
23–16
Data
7–0
Data
23–16
Data
39–32
Data
55–48
Rev.7.00 Oct. 10, 2008 Page 431 of 1074
Section 13 Bus State Controller (BSC)
WE3,
CAS3,
DQM3
WE2,
CAS2,
DQM2
Strobe Signals
REJ09B0366-0700
WE1,
CAS1,
DQM1
Asserted
Asserted Asserted
Asserted Asserted
Asserted Asserted
Asserted Asserted
Asserted Asserted
Asserted Asserted
Asserted Asserted
WE0,
CAS0,
DQM0
Asserted

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