PIC18F86J50T-I/PT Microchip Technology, PIC18F86J50T-I/PT Datasheet - Page 460

• Manufacturer Part Number: PIC18F86J50T-I/PT
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,TQFP,64PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F86J50T-I/PT

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 65
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TFQFP
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3904 B
• Interface Type: I2C, MSSP, SPI, EUSART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 65
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183022, DM183032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162087 - HEADER MPLAB ICD2 18F87J50 68/84MA180021 - MODULE PLUG-IN 18F87J50 FS USBAC164328 - MODULE SKT FOR 80TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC18F86J50T-I/PTTR

PIC18F87J50 FAMILY
29.2
The following sections give the technical details of the packages.
DS39775C-page 460
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
L
Dimension Limits
E1
NOTE 2
φ
Units
A2
A1
E1
D1
L1
N
D
e
A
L
E
b
α
β
φ
c
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
© 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
α
A2