SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 1170

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SAM9G45

Manufacturer Part Number
SAM9G45
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G45

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
Table 47-1.
Table 47-2.
Table 47-3.
Table 47-4.
47.2
1170
Ball Land
Soldering Mask Opening
400
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Soldering Profile
SAM9G45
Soldering Information
Device and 324-ball TFBGA Package Maximum Weight
324-ball TFBGA Package Characteristics
Package Reference
This package respects the recommendations of the NEMI User Group.
Table 47-5
Table 47-5.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
It is recommended to apply a soldering temperature higher than 250°C
gives the recommended soldering profile from J-STD-020C.
Soldering Profile
mg
0.4 mm +/- 0.05
0.275 mm +/- 0.03
3
MO-210
e1
Green Package
3 C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 C
6 C/sec. max.
8 min. max.
6438G–ATARM–19-Apr-11

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