DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 987

• Manufacturer Part Number: DF2376VFQ33V
• Description: IC H8S/2376 MCU FLASH 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2376VFQ33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 30K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Note:
Execution of Erasure
Determination of
Erasure Result
Operation for Erasure
Error
Operation for FKEY
Clear
Switching MATs by
FMATS
* Switching FMATS by a program in the on-chip RAM enables this area to be used.
Item
On-chip
RAM
Storable/Executable Area
User
Boot
MAT
× *
×
×
×
×
Section 21 Flash Memory (0.18-μm F-ZTAT Version)
(Expanded
External
Space
Mode)
×
×
Rev.7.00 Mar. 18, 2009 page 919 of 1136
User
MAT
Selected MAT
User
Boot
MAT
REJ09B0109-0700
Storage Area
Embedded
Program