DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 931
![IC H8S/2376 MCU FLASH 144LQFP](/photos/28/61/286116/144-lqfp__plqp0144kc-a_sml.jpg)
DF2376VFQ33V
Manufacturer Part Number
DF2376VFQ33V
Description
IC H8S/2376 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2376VFQ33V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2376VFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 931 of 1208
- Download datasheet (8Mb)
Mode pin
Legend:
FCCS:
FPCS:
FECS:
FKEY:
FMATS: Flash MAT select register
FTDAR: Flash transfer destination address register
FVACR: Flash vector address control register
Notes:
To read from or write to the registers, the FLSHE bit in the system control
register (SYSCR) must be set to 1.
* 384 kbytes, 256 kbytes
Flash code control status register
Flash program code select register
Flash erase code select register
Flash key code register
FMATS
FTDAR
FVACR
FCCS
FPCS
FECS
FKEY
Figure 21.1 Block Diagram of Flash Memory
Operating
mode
Internal data bus (16 bits)
Control unit
Internal address bus
Flash memory
Section 21 Flash Memory (0.18-μm F-ZTAT Version)
Rev.7.00 Mar. 18, 2009 page 863 of 1136
User MAT: 512 kbytes*
User boot MAT: 8 kbytes
Memory MAT unit
REJ09B0109-0700
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