DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 1093
![IC H8S/2376 MCU FLASH 144LQFP](/photos/28/61/286116/144-lqfp__plqp0144kc-a_sml.jpg)
DF2376VFQ33V
Manufacturer Part Number
DF2376VFQ33V
Description
IC H8S/2376 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2376VFQ33V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2376VFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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(2) Control Signal Timing
Table 26.6 Control Signal Timing
Conditions: V
Item
RES setup time
RES pulse width
NMI setup time
NMI hold time
NMI pulse width (in recovery from
software standby mode)
IRQ setup time
IRQ hold time
IRQ pulse width (in recovery from
software standby mode)
0 V, φ = 8 MHz to 33 MHz, T
T
a
CC
= −40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
RESS
RESW
NMIS
NMIH
NMIW
IRQS
IRQH
IRQW
CC
= 3.0 V to 3.6 V, V
a
= −20°C to +75°C (regular specifications),
Min.
200
20
150
10
200
150
10
200
Rev.7.00 Mar. 18, 2009 page 1025 of 1136
Max.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
ref
Section 26 Electrical Characteristics
= 3.0 V to AV
Unit
ns
t
ns
ns
cyc
CC
Test Conditions
Figure 26.5
Figure 26.6
REJ09B0109-0700
, V
SS
= AV
SS
=
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