DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 1127
![IC H8S/2376 MCU FLASH 144LQFP](/photos/28/61/286116/144-lqfp__plqp0144kc-a_sml.jpg)
DF2376VFQ33V
Manufacturer Part Number
DF2376VFQ33V
Description
IC H8S/2376 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2376VFQ33V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2376VFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 1127 of 1208
- Download datasheet (8Mb)
Note:
Item
Self-refresh precharge time 1
Self-refresh precharge time 2
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
Address delay time 2 *
CS delay time 4 *
DQM delay time *
CKE delay time *
Read data setup time 3 *
Read data hold time 3 *
Write data delay time 2 *
Write data hold time 4 *
* Supported by the H8S/2378R, H8S/2374R, H8S/2372R, H8S/2371R, and H8S/2370R
only.
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
RPS1
RPS2
WTS
WTH
BREQS
BACD
BZD
BRQOD
AD2
CSD4
DQMD
CKED
RDS3
RDH3
WDD
WDH4
Min.
2.5 × t
3.0 × t
25
5
30
⎯
⎯
⎯
⎯
⎯
⎯
⎯
15
0
⎯
2
cyc
cyc
−20
−20
Rev.7.00 Mar. 18, 2009 page 1059 of 1136
Max.
⎯
⎯
⎯
⎯
⎯
15
40
25
16.5
16.5
16.5
16.5
⎯
⎯
31.5
⎯
Section 26 Electrical Characteristics
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
REJ09B0109-0700
Test Conditions
Figures 26.21
and 26.22
Figures 26.9 and
26.15
Figure 26.23
Figure 26.24
Figure 26.25
Figure 26.25
Figure 26.25
Figures 26.26
and 26.27
Figure 26.25
Figure 26.25
Figure 26.25
Figure 26.25
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