DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 477

IC H8S/2376 MCU FLASH 144LQFP

DF2376VFQ33V

Manufacturer Part Number
DF2376VFQ33V
Description
IC H8S/2376 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2376VFQ33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2376VFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
External Request/Cycle Steal Mode/Normal Transfer Mode: In external request mode, an
EXDMA transfer cycle is started a minimum of three cycles after a transfer request is accepted.
The next transfer request is accepted after the end of a one-transfer-unit EXDMA cycle. For
external bus space CPU cycles, at least two bus cycles are generated before the next EXDMA
cycle.
If a transfer request is generated for another channel, an EXDMA cycle for the other channel is
generated before the next EXDMA cycle.
The EDREQ pin sensing timing is different for low level sensing and falling edge sensing. The
same applies to transfer request acceptance and transfer start timing.
Figures 8.35 to 8.38 show operation timing examples for various conditions.
φ pin
EDREQ
EDRAK
Bus cycle
ETEND
EDA bit
Figure 8.35 External Request/Cycle Steal Mode/Normal Transfer Mode
1
Bus release
(No Contention/Dual Address Mode/Low Level Sensing)
EXDMA
read
EXDMA
write
Bus release
3 cycles
Rev.7.00 Mar. 18, 2009 page 409 of 1136
Section 8 EXDMA Controller (EXDMAC)
EXDMA
Last transfer cycle
read
EXDMA
write
REJ09B0109-0700
0
Bus release

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