DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 470

• Manufacturer Part Number: DF2376VFQ33V
• Description: IC H8S/2376 MCU FLASH 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2376VFQ33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 30K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 8 EXDMA Controller (EXDMAC)
After one byte or word has been transferred in response to one transfer request, the bus is released.
While the bus is released, one or more CPU, DMAC, or DTC bus cycles are initiated.
Rev.7.00 Mar. 18, 2009 page 402 of 1136
REJ09B0109-0700
φ
Address bus
HWR
LWR
EDACK
ETEND
Bus release
Figure 8.25 Example of Single Address Mode (Word Write) Transfer
DMA write
Bus release
DMA write
Bus release
Last transfer cycle
DMA write
Bus
releas e