DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 446
![IC H8S/2376 MCU FLASH 144LQFP](/photos/28/61/286116/144-lqfp__plqp0144kc-a_sml.jpg)
DF2376VFQ33V
Manufacturer Part Number
DF2376VFQ33V
Description
IC H8S/2376 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2376VFQ33V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2376VFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 8 EXDMA Controller (EXDMAC)
Rev.7.00 Mar. 18, 2009 page 378 of 1136
REJ09B0109-0700
Transfer from external memory to external device with DACK
Transfer from external device with DACK to external memory
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
Figure 8.4 Example of Timing in Single Address Mode
EXDMA cycle
EXDMA cycle
EDSAR
EDDAR
Address to external memory space
RD signal to external memory space
Data output from external memory
Address to external memory space
WR signal to external memory space
Data output from external device
with DACK
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