DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 283

• Manufacturer Part Number: DF2376VFQ33V
• Description: IC H8S/2376 MCU FLASH 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2376VFQ33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 30K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

When DDS = 0 or EDDS = 0: When DRAM space is accessed in DMAC or EXDMAC single
address transfer mode, full access (normal access) is always performed. With the DRAM interface,
the DACK or EDACK output goes low from the T
In modes other than DMAC or EXDMAC single address transfer mode, burst access can be used
when accessing DRAM space.
Figure 6.42 shows the DACK or EDACK output timing for the DRAM interface when DDS = 0 or
EDDS = 0.
Read
Write
Note: n = 2 to 5
Figure 6.42 Example of DACK/EDACK Output Timing when DDS = 0 or EDDS = 0
DACK or EDACK
φ
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
T
p
Row address
(RAST = 0, CAST = 1)
High
High
T
r
r
state.
Rev.7.00 Mar. 18, 2009 page 215 of 1136
T
c1
Column address
Section 6 Bus Controller (BSC)
T
c2
REJ09B0109-0700
T
c3