DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 1157

IC H8S/2376 MCU FLASH 144LQFP

DF2376VFQ33V

Manufacturer Part Number
DF2376VFQ33V
Description
IC H8S/2376 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2376VFQ33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2376VFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Figure 26.29 DMAC and EXDMAC Single Address Transfer Timing: Three-State Access
φ
A23 to A0
CS7 to CS0
AS
RD
(read)
D15 to D0
(read)
HWR, LWR
(write)
D15 to D0
(write)
DACK0, DACK1
EDACK2, EDACK3
T
1
t
t
DACD1
EDACD1
Rev.7.00 Mar. 18, 2009 page 1089 of 1136
T
2
Section 26 Electrical Characteristics
T
3
t
t
REJ09B0109-0700
DACD2
EDACD2

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