MC9S12DT256MPVE Freescale Semiconductor, MC9S12DT256MPVE Datasheet - Page 1244

• Manufacturer Part Number: MC9S12DT256MPVE
• Description: IC MCU 256K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12DT256MPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Processor Series: S12D
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 1
• Operating Supply Voltage: 5 V to 2.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68KIT912DP256
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (8-ch x 10-bit)
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 12KB
• Cpu Speed: 25MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.1.9
This section describes the characteristics of all I/O pins except EXTAL, XTAL,XFC,TEST,VREGEN and
supply pins.
1246
Conditions are 3.15 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,XFC,TEST, VREGEN and supply pins.
Num C
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
P Input high voltage
P Input low voltage
C Input hysteresis
C Input leakage current (pins in high impedance input
C Output high voltage (pins in output mode)
P Output high voltage (pins in output mode)
C Output low voltage (pins in output mode)
P Output low voltage (pins in output mode)
P Internal pull up device current, tested at V
C Internal pull up device current, tested at V
P Internal pull down device current, tested at V
C Internal pull down device current, tested at V
P Internal pull up resistance
P Internal pull down resistance
D Input capacitance
T Input high voltage
T Input low voltage
T Injection current
Internal pull up/pull down device specification (items 9 to 12) only valid for masksets 0L15Y & 1L15Y
mode)
VIH min > input voltage > VIL max
VIH min > input voltage > VIL max
I/O Characteristics
V in = V DD35 or V SS35
Partial drive I OH = –0.75 mA
Full drive I
Partial Drive I
Full Drive I OL = +4.75 mA
Single pin limit
Total device limit, sum of all injected currents
Internal pull up/pull down device specification (items 13 to 14) valid for all other masksets
1
The internal pull up/pull down device specification is different depending on
maskset.
OH
DD35
2
OL
= –4 mA
= +0.9 mA
< 3.6 V temperature from –40 C to +140 C, unless otherwise noted
Rating
Table A-6. 3.3-V I/O Characteristics
MC9S12XDP512 Data Sheet, Rev. 2.21
IL
IH
max.
min.
IH
IL
CAUTION
max.
min.
Symbol
V
R
R
I
I
V
V
I
I
V
V
I
I
V
V
PUH
PDH
V
V
C
PUL
PDL
ICS
ICP
HYS
I
PDH
PUL
OH
OH
OL
OL
in
IH
IH
IL
IL
in
V
V
V
0.65*V
DD35
DD35
SS35
–2.5
Min
–25
–1
25
25
—
—
—
—
—
-6
—
—
6
– 0.3
– 0.4
– 0.4
DD35
Typ
250
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6
Freescale Semiconductor
V
0.35*V
DD35
Max
–60
0.4
0.4
2.5
60
55
55
25
—
—
—
—
—
—
1
-
+ 0.3
DD35
Unit
mV
mA
K
K
pF
V
V
V
V
V
V
V
V
A
A
A
A
A