SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 57

• Manufacturer Part Number: SAM9G45
• Manufacturer: Atmel Corporation

Specifications of SAM9G45

• Flash (kbytes): 0 Kbytes
• Pin Count: 324
• Max. Operating Frequency: 400 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 160
• Ext Interrupts: 160
• Usb Transceiver: 3
• Usb Speed: Hi-Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 2
• Uart: 5
• Lin: 4
• Ssc: 2
• Ethernet: 1
• Sd / Emmc: 2
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: Yes
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 440
• Resistive Touch Screen: Yes
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 64
• Self Program Memory: NO
• External Bus Interface: 2
• Dram Memory: DDR2/LPDDR, SDRAM/LPSDR
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 0.9 to 1.1
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

11.4
11.4.1
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
NVM Boot
NVM Boot Sequence
The boot sequence on external memory devices can be controlled using the Boot Sequence
Register (BSCR). The 3 LSBs of the BSCR are available to control the sequence.
The user can then choose to bypass some steps shown in
Sequence Diagram”
Table 11-1.
BSCR Value
0
1
2
3
4
5
6
7
Boot Sequence Register Values
SPI0 NPCS0
according to the BSCR Value.
Y
Y
Y
Y
Y
-
-
-
SDCard
Y
-
-
-
-
-
-
-
NAND
Flash
Y
Y
-
-
-
-
-
-
SPI0 NPCS1
Y
Y
Y
Y
-
-
-
-
Figure 11-2 “NVM Bootloader
TWI EEPROM
Y
Y
Y
Y
Y
-
-
-
SAM9G35
SAM9G35
SAM-BA
Monitor
Y
Y
Y
Y
Y
Y
Y
Y
57
57