SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 307

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SAM9G45

Manufacturer Part Number
SAM9G45
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G45

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
25.5.4.2
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
Hardware Configuration
Software Configuration
16-bit LPDDR on EBI
The following configuration has to be performed:
The LP-DDR initialization sequence is described in the section “Low-power DDR1-SDRAM Ini-
tialization” in “DDR/SDR SDRAM Controller (DDRSDRC)”.
In this case VDDNF can be different from VDDIOM. NAND Flash device can be 3.3V or 1.8V
and wired on D16-D31 data bus. NFD0_ON_D16 is to be set to 1.
• Assign EBI_CS1 to the DDR2 controller by setting the bit EBI_CS1A in the EBI Chip Select
• Initialize the DDR2 Controller depending on the LP-DDR device and system bus frequency.
Register located in the bus matrix memory space.
SAM9G35
SAM9G35
307
307

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