LFDAS12XSDT Freescale Semiconductor, LFDAS12XSDT Datasheet - Page 664

• Manufacturer Part Number: LFDAS12XSDT
• Description: HARDWARE MC9S12XS 52-PIN
• Manufacturer: Freescale Semiconductor

Specifications of LFDAS12XSDT

• Module/board Type: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: -

Electrical Characteristics
1
2
3
4
5
664
Num
10
11
12
13
14
15
The values for thermal resistance are achieved by package simulations
Junction to ambient thermal resistance, θ
horizontal configuration in natural convection.
Junction to ambient thermal resistance, θ
horizontal configuration in natural convection.
Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-
STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is
being used with a heat sink.
Thermal characterization parameter Ψ
case as defined in JESD51-2. Ψ
enviroment.
1
2
3
4
5
6
7
8
9
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Thermal resistance LQFP 112, single sided PCB
Thermal resistance LQFP 112, double sided PCB
with 2 internal planes
Junction to Board LQFP 112
Junction to Case LQFP 112
Junction to Package Top LQFP 112
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
Thermal resistance LQFP 64, single sided PCB
Thermal resistance LQFP 64, double sided PCB
with 2 internal planes
Junction to Board LQFP 64
Junction to Case LQFP 64
Junction to Package Top LQFP 64
Table A-5. Thermal Package Characteristics (9S12XS256)
3
3
3
JT
Rating
is a useful value to use to estimate junction temperature in a steady state customer
4
4
JT
S12XS Family Reference Manual, Rev. 1.11
4
is the “resistance” from junction to reference point thermocouple on top center of the
JA
JA
5
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
5
5
LQFP 112
LQFP 64
QFP 80
2
2
2
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
Max
62
51
39
16
57
45
29
20
68
50
32
15
3
5
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit